Low internal stress technology is the use of multiple foaming equipment to foam the material multiple times, so that fluorine-free, bromin-free low internal stress extrusion (XPS) insulation board to achieve 100% perfect foaming, its dimensional stability than the traditional extrusion board more than double, the technology to overcome the world decades of unsolved extrusion board dimensional stability aging instability problem, Deformation, cracking, falling off and other drawbacks will not be repeated.
Fluorine-free, bromin-free low internal stress extrusion (XPS) insulation board using the world's advanced Germany Berstorf entire production line, Germany Kraussmaffei equipment.
Germany Kraussmaffei extruded board production line has a high degree of automation, comprehensive industrial production, a wide range of accurate data adjustable, accurate measurement, stable operation and other domestic extruded board production line does not have the advantages.
1. Imported blowing agent metering pump system: can control blowing agent flow accuracy within 1/10,000, shocking the industry.
2. Imported solid raw material measurement system: the world's advanced measurement control system, the advanced control accuracy can reach ±1g, to ensure that the amount of each raw material is accurate and stable, unqualified raw materials will cause automatic equipment shutdown, the system can ensure the stability of product quality.
3. Imported secondary extruder unit: has a very high level of automatic control, belongs to the international advanced production equipment in the industry.
4. Special mold for imported foaming molding equipment: SOHO with more than 50 times the domestic mold investment of "big money", lasted two years and three months, developed a core patented technology of "imported foaming molding equipment professional mold", one step ahead of the same industry an era.
1. Better dimensional stability
At 70℃±2℃, the dimensional stability of fluorine-free, bromin-free, low internal stress extruded board length, width, thickness direction ≤0.5%, (Note: conventional extruded board length, width, thickness direction < 1.5%)
2. Lower thermal conductivity
At 25℃, the thermal conductivity of fluoride-free, bromin-free and low internal stress extruded plate is less than 0.028 (W/m·k), (Note: the thermal conductivity of conventional extruded plate is 0.032W/m·k). At -20℃, the thermal conductivity of fluorine-free, bromin-free and low internal stress extruded plate is less than 0.025 (W/m·k), (Note: the thermal conductivity of conventional extruded plate is 0.030W/m·k).
3. Super pressure resistance, non-toxic green more environmentally friendly
The compression performance is better, and the compressive strength of the fluorine-free, bromin-free and low internal stress extruded board can be 150~1200KPa.
4. Security and stability are more reliable
No deformation, no cracking, no falling off, safe and reliable.
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